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INTEGRATED CIRCUITS
74ABT827 10-bit buffer/line driver, non-inverting (3-State)
Product specification Supersedes data of 1995 Sep 06 IC23 Data Handbook 1998 Jan 16
Philips Semiconductors
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
FEATURES
required
* Ideal where high speed, light loading, or increased fan-in are * Flow through pinout architecture for microprocessor oriented
applications
DESCRIPTION
The 74ABT827 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT827 10-bit buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. They have NOR Output Enables (OE0, OE1) for maximum control flexibility.
* Output capability: +64mA/-32mA * Slim 300 mil-wide plastic 24-pin package * Latch-up protection exceeds 500mA per Jedec Std 17 * ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
* Power-up 3-State * Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
SYMBOL tPLH tPHL CIN COUT ICCZ PARAMETER Propagation delay An to Yn Input capacitance Output capacitance Total supply current CONDITIONS Tamb = 25C; GND = 0V CL = 50pF; VCC = 5V VI = 0V or VCC Outputs disabled; VO = 0V or VCC Outputs disabled; VCC = 5.5V TYPICAL 3.0 4 7 500 UNIT ns pF pF nA
ORDERING INFORMATION
PACKAGES 24-Pin Plastic DIP 24-Pin plastic SO 24-Pin Plastic SSOP Type II 24-Pin Plastic TSSOP Type I TEMPERATURE RANGE -40C to +85C -40C to +85C -40C to +85C -40C to +85C OUTSIDE NORTH AMERICA 74ABT827 N 74ABT827 D 74ABT827 DB 74ABT827 PW NORTH AMERICA 74ABT827 N 74ABT827 D 74ABT827 DB 74ABT827PW DH DWG NUMBER SOT222-1 SOT137-1 SOT340-1 SOT355-1
1998 Jan 16
2
853-1618 18866
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
PIN CONFIGURATION
LOGIC SYMBOL
2 3 4 5 6 7 8 9 10 11
OE0 A0 A1 A2 A3 A4 A5 A6 A7
1 2 3 4 5 6 7 8 9
24 23 22 21 20 19 18 17 16 15 14 13 TOP VIEW
VCC Y0 Y1 Y2 1 13
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 OE0 OE1 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9
Y3 Y4 Y5 Y6 Y7 Y8 Y9 OE1 23 22 21 20 19 18 17 16 15 14
SA00234
FUNCTION TABLE
INPUTS OEn L L
SA00233
A8 10 A9 11 GND 12
OUTPUTS An L H X Yn L H Z
OPERATING MODE Transparent Transparent High impedance
H H L X Z = = = =
PIN DESCRIPTION
PIN NUMBER 1, 13 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 23, 22, 21, 20, 19, 18, 17, 16, 15, 14 10 20 SYMBOL OE0, OE1 A0-A9 Y0-Y9 GND VCC FUNCTION Output enable input (active-Low) Data inputs Data outputs Ground (0V) Positive supply voltage
High voltage level Low voltage level Don't care High impedance "off" state
LOGIC SYMBOL (IEEE/IEC)
1 13
& EN1
2 3 4 5 6 7 8 9 10 11
1
23 22 21 20 19 18 17 16 15 14
SA00235
1998 Jan 16
3
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
LOGIC DIAGRAM
A0 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 A8 10 A9 11
1 OE0 OE1 13 23 Y0 22 Y1 21 Y2 20 Y3 19 Y4 18 Y5 17 Y6 16 Y7 15 Y8 14 Y9
SA00236
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL VCC IIK VI IOK VOUT IOUT Tstg PARAMETER DC supply voltage DC input diode current DC input voltage3 DC output diode current DC output voltage3 DC output current Storage temperature range VO < 0 output in Off or High state output in Low state VI < 0 CONDITIONS RATING -0.5 to +7.0 -18 -1.2 to +7.0 -50 -0.5 to +5.5 128 -65 to 150 UNIT V mA V mA V mA C
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS SYMBOL VCC VI VIH VIL IOH IOL t/v Tamb DC supply voltage Input voltage High-level input voltage Low-level input voltage High-level output current Low-level output current Input transition rise or fall rate Operating free-air temperature range 0 -40 PARAMETER Min 4.5 0 2.0 0.8 -32 64 5 +85 Max 5.5 VCC V V V V mA mA ns/V C UNIT
1998 Jan 16
4
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
DC ELECTRICAL CHARACTERISTICS
LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25C Min VIK Input clamp voltage VCC = 4.5V; IIK = -18mA VCC = 4.5V; IOH = -3mA; VI = VIL or VIH VOH High-level output voltage VCC = 5.0V; IOH = -3mA; VI = VIL or VIH VCC = 4.5V; IOH = -32mA; VI = VIL or VIH VOL II IOFF IPU/IPD IOZH IOZL ICEX IO ICCH ICCL ICCZ Quiescent supply current Low-level output voltage Input leakage current Power-off leakage current Power-up/down 3-State output current3 3-State output High current 3-State output Low current Output HIgh leakage current Output current1 VCC = 4.5V; IOL = 64mA; VI = VIL or VIH VCC = 5.5V; VI = GND or 5.5V VCC = 0.0V; VO or VI 4.5V VCC = 2.0V; VO = 0.5V; VI = GND or VCC; V OE = VCC VCC = 5.5V; VO = 2.7V; VI = VIL or VIH VCC = 5.5V; VO = 0.5V; VI = VIL or VIH VCC = 5.5V; VO = 5.5V; VI = GND or VCC VCC = 5.5V; VO = 2.5V VCC = 5.5V; Outputs High, VI = GND or VCC VCC = 5.5V; Outputs Low, VI = GND or VCC VCC = 5.5V; Outputs 3-State; VI = GND or VCC Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V ICC Additional supply current per input pin2 Outputs 3-State, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V Outputs 3-State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V -50 2.5 3.0 2.0 Typ -0.9 2.9 3.4 2.4 0.42 0.01 5.0 5.0 5.0 -5.0 5.0 -80 0.5 25 0.5 0.5 0.01 0.5 0.55 1.0 100 50 50 -50 50 -180 250 38 250 1.5 50 1.5 -50 Max -1.2 2.5 3.0 2.0 0.55 1.0 100 50 50 -50 50 -180 250 38 250 1.5 50 1.5 Tamb = -40C to +85C Min Max -1.2 V V V V V A A A A A A mA A mA A mA mA mA UNIT
NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V " 10%, a transition time of up to 100sec is permitted.
1998 Jan 16
5
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500 LIMITS SYMBOL PARAMETER WAVEFORM Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation delay An to Yn Output enable time to High and Low level Output disable time from High and Low level 1 2 2 1.1 1.1 1.6 2.6 2.0 2.5 Tamb = +25oC VCC = +5.0V Typ 3.0 2.9 3.7 4.6 4.8 5.1 Max 4.4 4.1 5.1 5.9 6.3 6.6 Tamb = -40 to +85oC VCC = +5.0V 0.5V Min 1.1 1.1 1.6 2.6 2.0 2.5 Max 4.8 4.7 5.9 6.9 6.8 6.9 ns ns ns UNIT
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
3V 1.5V INPUT 0V tPLH tPHL VOH 1.5V OUTPUT VOL 1.5V Yn OUTPUT Yn OUTPUT tPZH VM 1.5V OEn INPUT VM tPZL VM tPHZ VM tPLZ
3.5V
VOL + 0.3V VOL VOH VOH - 0.3V 0V
SA00028
SA00206
Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Propagation Delays
Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times
TEST CIRCUIT AND WAVEFORM
7V From Output Under Test CL = 50 pF 500 S1 Open GND 500
Load Circuit
TEST tpd tPLZ/tPZL tPHZ/tPZH
S1 open 7V open
DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value.
SA00012
1998 Jan 16
6
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
DIP24: plastic dual in-line package; 24 leads (300 mil)
SOT222-1
1998 Jan 16
7
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
1998 Jan 16
8
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
1998 Jan 16
9
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
1998 Jan 16
10
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
DEFINITIONS
Data Sheet Identification
Objective Specification
Product Status
Formative or in Design
Definition
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Preliminary Specification
Preproduction Product
Product Specification
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the Semiconductor Chip Protection Act. (c) Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. (print code) Document order number: Date of release: July 1994 9397-750-03474

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